Flextein™ S51

FlexteinTM S51 is a 5.1 W/m∙K soft thermal interface gap filler with great thermal performance and high compliance. The material has extreme softness while maintaining elasticity and conformability. The Inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. It is ideal for use to fill gaps between high-power, heat-generating components and related heat sinks, boards or chassis.
FEATURES & BENEFITS APPLICATIONS PROPERTIES Ordering Guide Curve
  • Thermal conductivity 5.1 W/m·K