TIM GEL

Introduction


Thermal grease is a substance used to promote better heat conduction between two surfaces and is commonly used between a microprocessor and heatsink. Thermal Grease does not add mechanical strength to the bond between heat source and heat spreader. Its excellent surface wetting results in low interfacial resistance.





TIM GEL

Flextein™ MG201

Flextein MG201 is a thermally conductive liquid gap filling materials, two-component, cured either at room or elevated temperature. Prior to curing, the material maintains good thixotropic characteristics, easy to dispense. The result is a soft, form-in-place elastomer ideal for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. After cure, it won't pump from the interface as a result of thermal cycling and is dry to the touch.

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Flextein™ MG180R

Flextein MG180R is a thermally conductive liquid gap filling materials, two-component, cured either at room or elevated temperature. Prior to curing, the material maintains good thixotropic characteristics, easy to dispense and has good adhesion to many substrates. The result is a soft, form-in-place elastomer ideal for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. After cure, it won't pump from the interface as a result of thermal cycling and is dry to the touch.

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Flextein™ MG350

Flextein MG350 is a thermally conductive liquid gap filling material, two-component, cured either at room or elevated temperature. Prior to curing, the material maintains good thixotropic characteristics, and is easy to dispense. The result is a soft, form-in-place elastomer ideal for combining fragile components with high topography and / or stack-up tolerances to general heat sink or housing. After curing, it won't pump from the interface as a result of thermal cycling and is dry to the touch.

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Flextein™ MG180

Flextein MG180 is a thermally conductive liquid gap filling material two-component, cured either at room or elevated temperature. Prior to curing, the material maintains good thixotropic characteristics, and is easy to dispense. The result is a soft, form-in-place elastomer ideal for combining fragile components with high topography and / or stack-up tolerances to general heat sink or housing. After curing, it won't pump from the interface as a result of thermal cycling and is dry to the touch.

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Flextein™ TG845

Flextein TG845 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform to irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances. The cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.

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Flextein™ TG860

Flextein TG860 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. In addition to providing application flexibility and variable gap adaptation, TG860 will exert minimum stress on your component while maintaining interface contact to maximize thermal transfer. It requires no cure cycle and its cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.

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Flextein™ TG803

Flextein TG803 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform to irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances. The cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.

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Flextein® MG480L

Flextein® MG480L is a high performance, thermally conductive liquid gap filling materials. Two-component, cured either at room or elevated temperature. Prior to curing, it flows under pressure like grease. After cure, it won't pump from the interface as a result of thermal cycling and is dry to the touch. The result is a soft, form-in-place elastomer ideal for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. Flextein® MG480 is not designed to be a structural adhesive, and will lightly adhere to surfaces, thus improving surface contact, create a low thermal resistance.

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Flextein® TG870C

Flextein® TG870C is a field-curable high-performance fluid-type thermal interface material designed specifically for automated dispensing assembly applications. After curing, it is equivalent to a thermal pad, which is very easy to rework/repair and is suitable for heat dissipation with large thickness changes Modules or components. With its inherent adhesive properties, it does not require an adhesive layer, can be kept in use position, does not move, and has high reliability. At the same time, it has good wettability, which makes the mating parts fully contact and improves the heat conduction efficiency. It does not need to be die-cut, and can be directly dispensed between the heating element and the heat sink/housing. It can replace the conventional thermal pad and thermal grease to improve thermal conductivity and reduce costs.

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Flextein® ATG960

Flextein ATG960 is special designed for use in high performance devices requiring maximum thermal performance, excellent microwave absorption, low compression force and component reliability. In addition to providing application flexibility and variable gap adaptation, ATG960 will exert minimum stress on your component while maintaining interface contact to maximize thermal transfer. It requires no cure cycle and it’s cross-linked gel structure provides superior long term properties stability and reliable performance over conventional greases.

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Flextein® MG260

Flextein® MG260 is a thermally conductive liquid gap filling materials, two-component, cured either at room or elevated temperature. Prior to curing, the material maintains good thixotropic characteristics, easy to dispense and stays in place. The result is a soft, form-in-place elastomer ideal for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. After cure, it won't pump from the interface as a result of thermal cycling and is dry to the touch.

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Flextein™ TG802

Flextein TG802 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform to irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances. The cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.

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Flextein™ TG801

Flextein TG801 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform to irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances. The cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.

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