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      • TIM-PAD
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    • Adhesives & Encapsulates 
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    • EMI Shielding Management 
      • Conductive Elastomers
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    • Flexible Functional Materials 
      • NYS-SOFTOM™ Series Conductive Tape and Conductive Foam
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      • NYS-BOND™Series Heat-conducting Adhesive Tape
      • NYS-CUSH™Series Vibration Damping Cushion Material
      • NYS-WIN™Series Window Shielding Module
      • EFOH GRAPHITE COATED SILICONE FOAM
      • EFOG系列 PI包覆硅胶泡棉SMD
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Research & Development

Nystein R&D team is focusing on EMI & Thermal Management technology development and problem solving for field applications. Continuously helping customers to find cost-effective solutions is one of the key targets of the team. With almost 10% of total headcount dedicated in R&D area of the company, it guarantees that the team continues develop new materials, methods, processes and applications, in order to security a strong market position. Knowledge of markets & know-how.

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Testing Service

Our Testing Facilities including: Anechoic Chamber Lab (5381 sqft) , Polymer Chemistry Research lab,Reliability Testing Lab

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System Cooling Solution Design Service

Professional thermal design Engineering teamIs able to provide product-level thermal design schemes, conduct 3D modelling, select thermal conducting materials, design thermal conducting structures according to customers' product requirements, and conduct thermal simulation design with professional thermal simulation software for customers.Most importantly to solve heat dissipation pain points for customers.

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