Flextein 3000SF


Flextein 3000SF is a high-performance, compliant, silicone-free thermal interface material. By coupling extremely high thermal conductivity (3.0W/m·K) with exceptional wetting characteristics, Flextein 3000SF provides low thermal resistance between heat source component and heat dissipation part or housing. This makes it well-suited for applications where silicone-based pads are traditionally used as well as those applications which are silicone-sensitive, especially in optical industry. Flextein 3000SF is naturally tacky on both sides requiring no additional adhesive coating. The natural tack allows the pad to be held in place during assembly.

Product Description Typical Property Data

FEATURES & BENEFITS 

  • Thermal conductivity 3.0 W/m·K
  • Available in thicknesses from 0.012” (0.30mm) to 0.400”(10.0mm)
  • Silicone-free and RoHS Compliant.
  • Naturally tacky & re-workable
  • UL. 94 V-0
  •  

TYPICAL APPLICATIONS 

  • Automated Electronic Control Units (ECU's)
  • Power Supplies & Semiconductors
  • Memory & Power Modules
  • Microprocessors / Graphics Processors
  • Flat Panel Displays & Consumer Electronics

SELECTION GUIDE

PERFORMCE CURVE

FC@PROPERTIES FC@UNIT FC@TEST METHOD 3000SF
Appearance - Visual Blue
Thickness mm ASTM D374 0.30~10.0
Thermal Conductivity W/m·K Hot Disk 3.00
ASTM D5470 3.00
Thermal Resistance (@1mm,20psi) °C·in²/W ASTM D5470 0.40
°C·cm²/W 2.58
Hardness Shore OO ASTM D2240 25
Flame Rating - U.L 94 V-0
Dielectric Strength(@1MM) kV ASTM D149 >9.0
Volume Resistivity  Ω·cm ASTM D257 ≥4.0X1013
Density g/cm³ ASTM D792 1.60
Tensile Strength psi ASTM D412 30
Elongation % ASTM D412 60
Compression Deflection (%) at given pressure 10psi ASTM D575 23
50psi 58
100psi 85
Dielectric Constant @1MHz ASTM D150 3.2
Service Temp. °C Nystein -40~110
RoHS Compliant - Nystein YES