EFOG soft SMD (Surface Mount Device) Grounding Contact gasket is made of metalized polyimide film over high resilience silicone foam. The product is easy for solder and has good environment adaptability like wear and corrosion resistance, good compressibility, etc. EFOG still has good electrical conductivity and excellent elasticity after reflow soldering. FOG Gasket can replace conventional EMI gaskets (with tape), copper spring sheets and coated gaskets. It is used for circuit grounding of SMT (Surface Mount Technology) devices. EFOG is designed to be solder reflow compatible and are suitable for automatic processing. Depending on the material and structure used, the EFOG series can provide a variety of core specifications for selection.