EFOG soft SMD (Surface Mount Device) Grounding Contact gasket is made of metalized polyimide film over high resilience silicone foam. The product is easy for solder and has good environment adaptability like wear and corrosion resistance, good compressibility, etc. EFOG still has good electrical conductivity and excellent elasticity after reflow soldering. FOG Gasket can replace conventional EMI gaskets (with tape), copper spring sheets and coated gaskets. It is used for circuit grounding of SMT (Surface Mount Technology) devices. EFOG is designed to be solder reflow compatible and are suitable for automatic processing. Depending on the material and structure used, the EFOG series can provide a variety of core specifications for selection.
Product Features: • Low surface resistance.
• Reflow tunnel compatible to 260° C
• Excellent elasticity and resilience
• It is electrochemically compatible with most mounting surfaces; and has good conductivity and shielding effects.
• High temperature resistance, flame retardant.
• Good resilience, high abrasion resistance and shear resistance at the same time
• PI film coating can also be customized if other requirements are requiredFlame retardant Circuit grounding (surface mount technology) equipment for SMT.
• These contacts are designed to be reflow solderable,and Suitable for automatic processing.
Applications: •Automotive(Between screws and chassis) •Networking equipment(Panel seals,Cover seals,Grounding tabs) •Cabinet applications(Door seals,Vent seals) •Communication equipment and lighting equipment(Improved ground paths,Vent seals) |
Product configuration •Profile gaskets can be cut to specified lengths,kiss-cut on release liner, or mitered to form frame configurations •PI coating parameters can be customized
Composition of Product
|
特性 |
单位 |
R系列参数 |
E系列参数 |
测试标准 |
颜色 |
—— |
本色 |
本色 |
目视 |
硬度 |
|
55± 5 ( Shore C) |
20± 5 ( Shore A) |
ASTM D2240 |
垂直电阻 |
Ω |
≤0.05 |
≤0.1 |
ASTM F390 |
表面电阻 |
Ω/sq |
≤0.05 |
≤0.05 |
ASTM F390 |
瞬间耐温 |
℃ |
400 |
400 |
GB/T 2423.2 |
长期耐温 |
℃ |
-40~150 |
-40~80 |
GB/T 2423.2 |
阻燃性能 |
—— |
V1 |
HB |
UL 94 |
压缩设定 |
% |
≤ 5 |
≤ 15 |
ASTM D3574 |
焊接强度 |
gf/cm |
>1500 |
>800 |
NY测试 |
Typical reflow condutions chart: |