TIM-Gel (One Part)


Brief Introduction

Thermal grease is a substance used to promote better heat conduction between two surfaces and is commonly used between a microprocessor and heatsink. Thermal Grease does not add mechanical strength to the bond between heat source and heat spreader. Its excellent surface wetting results in low interfacial resistance.

FC@PROPERTIES FC@UNIT FC@TEST METHOD TG801 TG802 TG802FW TG803 TG845 TG860 TG861 TG880
Appearance - Visual Light yellow Dark Gray Dark Gray Pink Gray Gray Gray Gray
Flow Rate g/min Nystein 26 30 30 22 35 15 20 20
Thermal Conductivity W/m·K Hot Disk 3.0 2.0 2.0 3.5 4.5 6.0 6.0 8.0
ASTM D5470 3.0 2.0 2.0 3.5 4.5 6.0 6.0 8.0
Thermal Resistance
(@1mm,20psi)
°C·in²/W ASTM D5470 0.08 0.10 0.10 0.07 0.06 0.04 0.032 0.022
°C·cm²/W 0.52 0.65 0.65 0.45 0.39 0.26 0.206 0.142
Min.Used Thickness mm Nystein 0.08 0.08 0.08 0.08 0.08 0.08 0.08 0.08
Flame Rating - U.L 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X1013 ≥1.0X1014 ≥1.0X1014 ≥1.0X1013 ≥1.0X1010 ≥1.0X109 ≥1.0X109 ≥1.0X109
Density g/cm³ ASTM D792 3.00 2.60 2.60 3.05 3.05 3.25 3.25 3.25
Dielectric Constant @1MHz ASTM D150 6.8 6.3 6.3 6.5 9.5 13.5 13.5 12.5
TML(CVCM) % ASTM E595 ≤0.20(0.08) ≤0.15(0.05) ≤0.15(0.05) ≤0.15(0.05) ≤0.15(0.05) ≤0.12(0.01) ≤0.12(0.01) ≤0.12(0.01)
Low volatility content (D4-D20) ppm Gas Chromatograph <80 <100 <100 <50 <50 <20 <20 <20
Service Temp °C Nystein -60~200 -60~200 -60~200 -60~200 -60~200 -60~200 -60~200 -60~200
RoHS Compliant - Nystein YES YES YES YES YES YES YES YES