Thermal grease is a substance used to promote better heat conduction between two surfaces and is commonly used between a microprocessor and heatsink. Thermal Grease does not add mechanical strength to the bond between heat source and heat spreader. Its excellent surface wetting results in low interfacial resistance.
PROPERTIES | UNIT | TEST METHOD | TG802 | TG803 | TG845 | TG850 | TG860 | TG880 | TG890 | TG892 |
---|---|---|---|---|---|---|---|---|---|---|
Appearance | - | Visual | Dark Gray | Pink | Dark Gray | Blue | Gray | Gray | Ash Gray | Gray |
Flow Rate | g/min | Nystein | 30 | 22 | 35 | 18 | 35 | 20 | 20 | 10 |
Thermal Conductivity | W/m·K | Hot Disk | 2.0 | 3.5 | 4.5 | 5.0 | 6.0 | 8.0 | 9.0 | 12 |
Thermal Resistance | °C·in²/W | ASTM D5470 | 0.10 | 0.07 | 0.06 | 0.06 | 0.04 | 0.022 | 0.036 | 0.027 |
Min.Used Thickness | mm | Nystein | 0.08 | 0.08 | 0.08 | 0.08 | 0.08 | 0.08 | 0.08 | 0.08 |
Flame Rating | - | U.L | 94V-0 | 94V-0 | 94V-0 | 94V-0 | 94V-0 | 94V-0 | 94V-0 | 94V-1 |
Volume Resistivity | Ω·cm | ASTM D257 | ≥1.0X1012 | ≥1.0X1012 | ≥1.0X1012 | ≥1.0X1012 | ≥1.0X1012 | ≥1.0X1012 | ≥1.0X1012 | ≥1.0X1012 |
Density | g/cm³ | ASTM D792 | 2.60 | 3.10 | 3.15 | 3.20 | 3.25 | 3.25 | 3.40 | 3.35 |
Service Temp | °C | Nystein | -60~150 | -60~150 | -60~150 | -60~150 | -60~150 | -60~150 | -60~150 | -60~201 |
RoHS Compliant | - | Nystein | YES | YES | YES | YES | YES | YES | YES | YES |
Flextein TG892
Flextein TG892 is a thermally conductive gel material with an ultra-high thermal conductivity of 12 ...
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Flextein TG850是一款高性能流体型导热界面材料,适用于厚度变化较大的散热模组或元器件。其 固有的胶粘特性,无需粘合层,同时具有良好的润湿性,使配合部件充分接触而提高热传导效率。
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Flextein TG802 is specially designed for use in high performance devices requiring minimal thermal r...
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Flextein TG803 is specially designed for use in high performance devices requiring minimal thermal r...
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Flextein TG845 is specially designed for use in high performance devices requiring minimal thermal r...
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Flextein TG860 is specially designed for use in high performance devices requiring minimal thermal ...
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Flextein TG880 is specially designed for use in high performance devices requiring minimal thermal r...
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Thermal conductivity 10.0 W/m·k , Ultra low thermal resistance Low out-gassing Ultra low compres...
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