TIM-Gel (One Part)

Brief Introduction

Thermal grease is a substance used to promote better heat conduction between two surfaces and is commonly used between a microprocessor and heatsink. Thermal Grease does not add mechanical strength to the bond between heat source and heat spreader. Its excellent surface wetting results in low interfacial resistance.

PROPERTIES UNIT TEST METHOD TG802 TG803 TG845 TG850 TG860 TG880 TG890 TG892
Appearance - Visual Dark Gray Pink Dark Gray Blue Gray Gray Ash Gray Gray
Flow Rate g/min Nystein 30 22 35 18 35 20 20 10
Thermal Conductivity W/m·K Hot Disk 2.0 3.5 4.5 5.0 6.0 8.0 9.0 12
Thermal Resistance °C·in²/W ASTM D5470 0.10 0.07 0.06 0.06 0.04 0.022 0.036 0.027
Min.Used Thickness mm Nystein 0.08 0.08 0.08 0.08 0.08 0.08 0.08 0.08
Flame Rating - U.L 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0 94V-1
Volume Resistivity Ω·cm ASTM D257 ≥1.0X1012 ≥1.0X1012 ≥1.0X1012 ≥1.0X1012 ≥1.0X1012 ≥1.0X1012 ≥1.0X1012 ≥1.0X1012
Density g/cm³ ASTM D792 2.60 3.10 3.15 3.20 3.25 3.25 3.40 3.35
Service Temp °C Nystein -60~150 -60~150 -60~150 -60~150 -60~150 -60~150 -60~150 -60~201
RoHS Compliant - Nystein YES YES YES YES YES YES YES YES