Thermal grease is a substance used to promote better heat conduction between two surfaces and is commonly used between a microprocessor and heatsink. Thermal Grease does not add mechanical strength to the bond between heat source and heat spreader. Its excellent surface wetting results in low interfacial resistance.
FC@PROPERTIES | FC@UNIT | FC@TEST METHOD | TG801 | TG802 | TG802FW | TG803 | TG845 | TG860 | TG861 | TG880 |
---|---|---|---|---|---|---|---|---|---|---|
Appearance | - | Visual | Light yellow | Dark Gray | Dark Gray | Pink | Gray | Gray | Gray | Gray |
Flow Rate | g/min | Nystein | 26 | 30 | 30 | 22 | 35 | 15 | 20 | 20 |
Thermal Conductivity | W/m·K | Hot Disk | 3.0 | 2.0 | 2.0 | 3.5 | 4.5 | 6.0 | 6.0 | 8.0 |
ASTM D5470 | 3.0 | 2.0 | 2.0 | 3.5 | 4.5 | 6.0 | 6.0 | 8.0 | ||
Thermal Resistance (@1mm,20psi) |
°C·in²/W | ASTM D5470 | 0.08 | 0.10 | 0.10 | 0.07 | 0.06 | 0.04 | 0.032 | 0.022 |
°C·cm²/W | 0.52 | 0.65 | 0.65 | 0.45 | 0.39 | 0.26 | 0.206 | 0.142 | ||
Min.Used Thickness | mm | Nystein | 0.08 | 0.08 | 0.08 | 0.08 | 0.08 | 0.08 | 0.08 | 0.08 |
Flame Rating | - | U.L | 94V-0 | 94V-0 | 94V-0 | 94V-0 | 94V-0 | 94V-0 | 94V-0 | 94V-0 |
Volume Resistivity | Ω·cm | ASTM D257 | ≥1.0X1013 | ≥1.0X1014 | ≥1.0X1014 | ≥1.0X1013 | ≥1.0X1010 | ≥1.0X109 | ≥1.0X109 | ≥1.0X109 |
Density | g/cm³ | ASTM D792 | 3.00 | 2.60 | 2.60 | 3.05 | 3.05 | 3.25 | 3.25 | 3.25 |
Dielectric Constant | @1MHz | ASTM D150 | 6.8 | 6.3 | 6.3 | 6.5 | 9.5 | 13.5 | 13.5 | 12.5 |
TML(CVCM) | % | ASTM E595 | ≤0.20(0.08) | ≤0.15(0.05) | ≤0.15(0.05) | ≤0.15(0.05) | ≤0.15(0.05) | ≤0.12(0.01) | ≤0.12(0.01) | ≤0.12(0.01) |
Low volatility content (D4-D20) | ppm | Gas Chromatograph | <80 | <100 | <100 | <50 | <50 | <20 | <20 | <20 |
Service Temp | °C | Nystein | -60~200 | -60~200 | -60~200 | -60~200 | -60~200 | -60~200 | -60~200 | -60~200 |
RoHS Compliant | - | Nystein | YES | YES | YES | YES | YES | YES | YES | YES |
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Thermal conductivity 12.0 W/m·k Ultra low thermal resistance Low out-gassing Ultra low compr...
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