TIM-Pad (Silicon Free)

Brief Introduction

Silicone free thermal interface material is a thermally conductive, electrically insulatinggap pad specially designed for silicones sensitive environments, such as automotive electronics, Avionics, consumer electronics, etc. Products have no silicone extractable.

PROPERTIES UNIT TEST METHOD S2000 S3000 S4000 S6000 S8000 S10000
Appearance - Visual Yellow Blue Violet
Sky Blue
 Grey Grey
Thickness mm ASTM D374 0.5~4.0 0.5~4.0 0.5~4.0 0.5~4.0 0.5~4.0 1.0~4.0
Thermal  Conductivity W/m·K Hot Disk 2.00 3.00 4.00 6.00 8.00 10.00
Hardness Shore OO ASTM D2240 65 65 65 65 65 65
Flame Rating - U.L 94 V-0 V-0 V-0 V-0 V-0 V-0
Dielectric Strength(@1MM) kV ASTM D149 ≥6.0 ≥6.0 ≥6.0 ≥6.0 ≥6.0 ≥6.0
Volume Resistivity  Ω·cm ASTM D257 ≥1.0X1011 ≥1.0X1011 ≥1.0X1011 ≥1.0X1011 ≥1.0X1011 ≥1.0X1011
Density g/cm³ ASTM D792 2.40 3.00 3.10 3.40 3.60 3.40
Dielectric Constant @1MHz ASTM D150 6.5 7 7.1 7.6 7.9 6.8
Service Temp. °C Nystein -40~110 -40~110 -40~110 -40~110 -40~110 -40~110
RoHS Compliant - Nystein YES YES YES YES YES YES