TIM-Pad (Silicon Free)


Brief Introduction

Silicone free thermal interface material is a thermally conductive, electrically insulatinggap pad specially designed for silicones sensitive environments, such as automotive electronics, Avionics, consumer electronics, etc. Products have no silicone extractable.

FC@PROPERTIES FC@UNIT FC@TEST METHOD 2000SF 3000SF 4000SF 10000SF
Appearance - Visual White Blue Violet
Grey
Thickness mm ASTM D374 0.25~10.0 0.30~10.0 0.30~10.0 0.50~10.0
Thermal 
Conductivity
W/m·K Hot Disk 2.00 3.00 4.00 10.00
ASTM D5470 2.00 3.00 4.00 10.00
Thermal Resistance
(@1mm,20psi)
°C·in²/W ASTM D5470 0.70 0.40 0.42 0.24
°C·cm²/W 4.52 2.58 2.71 1.55
Hardness Shore OO ASTM D2240 60 25 55 49
Flame Rating - U.L 94 V-0 V-0 V-0 V-0
Dielectric Strength(@1MM) kV ASTM D149 >9.0 >9.0 >9.0 >8.0
Volume Resistivity  Ω·cm ASTM D257 ≥1.0X1014 ≥4.0X1013 ≥5.0X1013 1.0×1013
Density g/cm³ ASTM D792 2.40 1.60 1.60 3.55
Tensile Strength psi ASTM D412 36 30 32 30
Elongation % ASTM D412 55 60 50 40
Compression 
Deflection (%) at  
given pressure
10psi ASTM D575 8 23 12 13
50psi 20 58 35 35
100psi 35 85 62 52
Dielectric Constant @1MHz ASTM D150 6.5 3.2 3.5 6
Service Temp. °C Nystein -40~110 -40~110 -40~110 -40~120
RoHS Compliant - Nystein YES YES YES YES