CG-9011, a Nystein proprietary product, is a "Fast Cure" Silver/Copper FIP conductive gasket cured at room temperature. With guaranteed conductivity and flow rate, it features shortened curing time by adjusting ingredients mixing ratio. The product is an ideal option for mass production.
With low hardness, good elasticity and low compression set, NYS-CURETM
CG-9011 has good adhesion to metal and plastic surfaces. The product can be applied to optical transceivers, telecommunication base stations, radar equipment, handheld devices and consumer electronics.
Features and Benefits
Fast curing and formation;
Excellent EMI shielding effectiveness, over 90dB;
Room temperature curing to avoid negative impact on enclosure and other component(s);
Saving on raw material, assembly labors;
Saving on tooling costs, allowing fast prototyping.
Minimum: width 0.5 × height 0.25 (mm)
Recommended: width 1.0 × height 0.73 (mm)
Maximum: width 2.5 × height 1.7 (mm)
1. Dispensing cross section defaults to D shape, Δ shape is determined as per actual product.
2. When dispensing size exceeds the maximum limit, elastomer strip is recommended.