TIM GEL

Introduction


Thermal grease is a substance used to promote better heat conduction between two surfaces and is commonly used between a microprocessor and heatsink. Thermal Grease does not add mechanical strength to the bond between heat source and heat spreader. Its excellent surface wetting results in low interfacial resistance.





TIM GEL

Flextein™ MG350

Flextein MG350 is a thermally conductive liquid gap filling material, two-component, cured either at room or elevated temperature. Prior to curing, the material maintains good thixotropic characteristics, and is easy to dispense. The result is a soft, form-in-place elastomer ideal for combining fragile components with high topography and / or stack-up tolerances to general heat sink or housing. After curing, it won't pump from the interface as a result of thermal cycling and is dry to the touch.

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Flextein™ MG180

Flextein MG180 is a thermally conductive liquid gap filling material two-component, cured either at room or elevated temperature. Prior to curing, the material maintains good thixotropic characteristics, and is easy to dispense. The result is a soft, form-in-place elastomer ideal for combining fragile components with high topography and / or stack-up tolerances to general heat sink or housing. After curing, it won't pump from the interface as a result of thermal cycling and is dry to the touch.

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Flextein™ TG845

Flextein TG845 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform to irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances. The cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.

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Flextein™ TG860

Flextein TG860 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. In addition to providing application flexibility and variable gap adaptation, TG860 will exert minimum stress on your component while maintaining interface contact to maximize thermal transfer. It requires no cure cycle and its cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.

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Flextein™ TG803

Flextein TG803 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform to irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances. The cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.

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Flextein™ TG802

Flextein TG802 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform to irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances. The cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.

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Flextein™ TG801

Flextein TG801 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform to irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances. The cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.

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