FIP

Introduction

With programmable automated robot, EMI gaskets can be dispensed onto metal, or conductive painted, plated, or metallic surfaces in the electronic enclosures. Form-In-Place (FIP) is suitable for applications that requires environmental sealing, has complex or rounded surfaces, or contains miniature devices requiring a precision gasket, thus protecting the enclosure against internally and externally radiated interference and environmental elements.FIPprovides the lowest total cost for small cross section and complex pattern applications. A range of conductive fillers can be selected to meet critical design requirement.


FIP

CG-9010 High Grade

room temperature curing Silver/Copper conductive

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CG-8020 Fast Dispensing

NYSTEIN (FORM-IN-PLACE) gasketing is...

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CG-8021 Ultra Soft

NYSTEIN (FORM-IN-PLACE) gasketing is custom process where a

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CG-6020

CG-6020, a Nystein star product, is a high temperature

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CG-5011 Ultra Fine

room temperature curing, small Silver/Nickel filler size FIP...

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CG-9011 Fast Cure

a room temperature "Fast Cure" Silver/Copper FIP conductive gasket...

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CG-7010 Corrosion Resistant

NYSTEIN (FORM-IN-PLACE) gasketing is

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CG-8021R Ultra Soft

CG-8021R, a Nystein proprietary product, is a room temperature

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CG-8025

CG-8025, a Nystein proprietary product, is a high temperature

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Custom solutions

Custom solutions

Our custom solutions give you a competitive edge.

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Contact Us

Contact Us

Contact us for information on our company, solutions and products.

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