FIP

Introduction

With programmable automated robot, EMI gaskets can be dispensed onto metal, or conductive painted, plated, or metallic surfaces in the electronic enclosures. Form-In-Place (FIP) is suitable for applications that requires environmental sealing, has complex or rounded surfaces, or contains miniature devices requiring a precision gasket, thus protecting the enclosure against internally and externally radiated interference and environmental elements.FIPprovides the lowest total cost for small cross section and complex pattern applications. A range of conductive fillers can be selected to meet critical design requirement.


FIP

CG-9010 High Grade

room temperature curing Silver/Copper conductive FIP gasket...

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CG-8020 Fast Dispensing

NYSTEIN (FORM-IN-PLACE) gasketing is...

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CG-8021 Ultra Soft

NYSTEIN (FORM-IN-PLACE) gasketing is custom process where a

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CG-5011 Ultra Fine

room temperature curing, small Silver/Nickel filler size FIP...

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CG-9011 Fast Cure

a room temperature "Fast Cure" Silver/Copper FIP conductive gasket...

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CG-7010 Corrosion Resistant

NYSTEIN (FORM-IN-PLACE) gasketing is custom process where a

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