Thermal Management

In 21st century, the trend of replacing our conventional human daily tasks by using functional electronic devices is accelerating. Also with increased miniaturization of systems and increased circuit density, the excessive heat generated by active electronic components create obstacles to equipment operation. Performance issues may include a reduction of system speed, loss of noise margin, and catastrophic breakdown. Effectively managing the thermal issues to ensure reliable operation becomes critical to the electronic engineers.



Thermal Interface

Thermal interface material is applied in between heat source component and heat dissipation device to improve the thermal conductivity. Nystein’s thermal materials include gel, pad, insulator, grease, graphite sheet, and adhesive. They fit into different designs with their own characteristics. Our experienced experts can help you select right product to meet your design and production requirement.
Recommended thermal management products for vertical heat dissipation are S15, S28, S51, S30, HK78, HK118, SF2000, SF4000, TIM Bonding and TIM Grease.


In Plane Heat Dissipation

Nystein’s graphite sheet offers high in-plane thermal conductivity comparing to other thermal interface materials. Its thin, light weight and flexible properties make it widely used in applications with limited space and the need of alleviating hot spots, such as hand held devices.
Recommended thermal management products for in-plane heat spreading are TIM G80, TIM G810 and TIM G810R.

Ultra Soft

Nystein’s ultra-soft thermal interface material is developed for applications that require a minimum amount of pressure on components. In applications where vibration dampening and shock absorbing are in consideration, the viscoelastic nature of the material makes this type of product stand out. The ultra-soft version thermal interface material is also an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
Recommended thermal management products with high compressive & high deflective requirement are TIM Putty S30, TG801, TG803 and Ultra-soft S10.


Thermally Conductive Electrically Insulating

With the properties of high thermal conductivity, high breakdown voltage and high resistance to cut through force, this product family is applied to solve over-heating issues for power component assemblies, where the highest possible thermal, dielectric, and mechanical properties are required.
Recommended thermal management products with high voltage insulation are T4, T9, T10 and T20.






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